Integrated Wireless Power, Data Communication, and Thermal Sensing Systems for Autonomous Multisite Brain Implants
Springer International Publishing
ISBN 978-3-031-90839-2
Standardpreis
Bibliografische Daten
eBook. PDF
2025
XVI, 156 p. 121 illus., 70 illus. in color..
In englischer Sprache
Umfang: 156 S.
Verlag: Springer International Publishing
ISBN: 978-3-031-90839-2
Weiterführende bibliografische Daten
Das Werk ist Teil der Reihe: Synthesis Lectures on Engineering, Science, and Technology
Produktbeschreibung
This book provides professionals in microelectronic implantable bio-medical systems an overview of recent techniques in wireless power and data telemetry. State-of-the-art techniques are overviewed and original methods presented. The book features an up-to-date overview of CMOS wireless telemetry microelectronics for cortical implants. The book gathers all layers of microelectronics wireless power and data transmission for cortical implants, discusses them in a critical manner and proposes solutions, i.e., at circuit and systems and system levels. This book compiles relevant information into a coherent presentation of the technical issues, proposed solutions and their compared efficiency, and details the authors' original approaches. Professionals of microelectronics will find useful and accessible descriptions of the major issues and solutions to wireless telemetry. Researchers and professionals in bio-medical implantable systems will find fully justified novel methods in power and data telemetry and implantable systems telemetry architectures.
Autorinnen und Autoren
Produktsicherheit
Hersteller
Springer Nature Customer Service Center GmbH
ProductSafety@springernature.com