BÜCHER VERSANDKOSTENFREI INNERHALB DEUTSCHLANDS
eBook
Electronic Materials Innovations and Reliability in Advanced Memory Packaging
Springer International Publishing
ISBN 978-3-031-94795-7
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Bibliografische Daten
eBook. PDF. Weiches DRM (Wasserzeichen)
2025
XV, 178 p. 76 illus., 69 illus. in color..
In englischer Sprache
Umfang: 178 S.
Verlag: Springer International Publishing
ISBN: 978-3-031-94795-7
Weiterführende bibliografische Daten
Das Werk ist Teil der Reihe: Springer Series in Reliability Engineering Chemistry and Materials Science Chemistry and Material Science (R0)
Produktbeschreibung
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
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