BÜCHER VERSANDKOSTENFREI INNERHALB DEUTSCHLANDS
Electronic Materials Innovations and Reliability in Advanced Memory Packaging
Springer
ISBN 978-3-031-94794-0
Standardpreis
Bibliografische Daten
Fachbuch
Buch. Hardcover
2025
2 s/w-Abbildungen, 57 Farbabbildungen.
In englischer Sprache
Umfang: xv, 178 S.
Format (B x L): 15,5 x 23,5 cm
Verlag: Springer
ISBN: 978-3-031-94794-0
Weiterführende bibliografische Daten
Das Werk ist Teil der Reihe: Springer Series in Reliability Engineering
Produktbeschreibung
This book provides a comprehensive introduction the reliability, and electronic materials innovations in advanced memory device packaging from component to system level. Special features of this book are sections covering not only the advanced packaging materials, but also system level packaging and integration in memory modules and solid state drives (SSD).
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
The book is an extremely useful and applicable guide to professionals and students on materials reliability in memory device packaging - from component to system level.
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