Architecting the Future: Intelligent Systems for Embedded AI, Autonomous Technologies, and Digital Twins
8th IFIP TC 10 International Embedded Systems Symposium, IESS 2024, Gainesville, FL, USA, October 14-15, 2024, Proceedings
Springer
ISBN 978-3-032-07101-9
Standardpreis
Bibliografische Daten
Fachbuch
Buch. Hardcover
2025
44 s/w-Abbildungen.
Umfang: XII, 113 S.
Format (B x L): 16 x 24.1 cm
Gewicht: 364
Verlag: Springer
ISBN: 978-3-032-07101-9
Weiterführende bibliografische Daten
Das Werk ist Teil der Reihe: IFIP Advances in Information and Communication Technology
Produktbeschreibung
The 9 full papers included in this volume were carefully reviewed and selected from 10 submissions. They were organized in the following topical sections: Architectures and Integration for Intelligent Embedded Systems; Hardware-Aware Deep Learning for Edge and Mobile Platforms; Digital Twins and Smart Environments for Autonomous and Urban Systems.
Autorinnen und Autoren
Produktsicherheit
Hersteller
Springer Nature Customer Service Center GmbH
ProductSafety@springernature.com
BÜCHER VERSANDKOSTENFREI INNERHALB DEUTSCHLANDS
