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3rd International Congress of Electrical and Computer Engineering

ICECENG 2024

Springer

ISBN 978-3-031-88998-1

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235,39 €

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Bibliografische Daten

Fachbuch

Buch. Hardcover

2025

50 Farbabbildungen.

In englischer Sprache

Umfang: xxiii, 510 S.

Format (B x L): 15,5 x 23,5 cm

Verlag: Springer

ISBN: 978-3-031-88998-1

Weiterführende bibliografische Daten

Produktbeschreibung

This proceedings presents the papers included in the 3rd International Congress of Electrical and Computer Engineering (ICECENG), which took place in Bandirma, Turkey, 27-30 November 2024. The conference aims to bring together researchers, developers, and students in computing, technology trends, artificial intelligence, and security who are interested in studying the application of formal methods to the construction and analysis of models describing technological processes at both micro and macro levels. ICECENG’24 also aims to provide a platform for discussing the issues, challenges, opportunities, and findings of computer engineering research. The conference seeks to provide some answers and explore the processes, actions, challenges, and outcomes of learning and teaching. - Presents papers from the 3rd International Congress of Electrical and Computer Engineering (ICECENG 2024); - Brings together researchers, developers, students in computing, technology trends, artificial intelligence, and security; - Provides answers and explores the processes, actions, challenges, and outcomes of current trends in EE and CE.

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Kundeninformationen

Presents papers from the 3rd International Congress of Electrical and Computer Engineering (ICECENG 2024) Brings together researchers, developers, students in computing, technology trends, artificial intelligence, and security Provides answers and explores the processes, actions, challenges, and outcomes of current trends in EE and CE

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