Mohd Salleh / Che Halin / Abdul Razak / Ramli

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

EPITS 2022, 14-15 September, Langkawi, Malaysia

lieferbar ca. 10 Tage als Sonderdruck ohne Rückgaberecht

Rezensionen ansehen

Standardpreis

181,89 €

Preisangaben inkl. MwSt. Abhängig von der Lieferadresse kann die MwSt. an der Kasse variieren. Weitere Informationen

auch verfügbar als eBook (PDF) für 171,19 €

Fachbuch

Buch. Hardcover

2023

xli, 875 S. 89 s/w-Abbildungen, 386 Farbabbildungen, Bibliographien.

In englischer Sprache

Springer. ISBN 9789811992667

Format (B x L): 15,5 x 23,5 cm

Gewicht: 1712 g

Das Werk ist Teil der Reihe: Springer Proceedings in Physics; 289

Produktbeschreibung

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.