Erschienen: 12.08.2013 Abbildung von Wu | Advanced Measurement and Test III | 2013 | Selected, peer reviewed papers... | Volumes 718-720


Advanced Measurement and Test III

Selected, peer reviewed papers from the 2013 3rd International Conference on Advanced Measurement and Test (AMT 2013), March 13-14, 2013, Xiamen, China

lieferbar, ca. 10 Tage

561,75 €

inkl. Mwst.

2013. Buch. 2702 S. Softcover

Trans Tech Publications. ISBN 978-3-03785-716-8

Format (B x L): 17 x 24 cm

Gewicht: 200 g

In englischer Sprache


The primary aim of the proceeding is the combined coverage of the electronic test of devices, boards and systems?covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, failure analysis and back to process and design improvement at the advanced level. Such an approach enables the engineer to take into account the essential mechanical properties of the material itself and special features of practical implementation, including manufacturing technology, experimental results, and design characteristics.


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