Chemical-Mechanical Planarization of Semiconductor Materials

2004. Buch. xi, 428 S.: Bibliographien. Hardcover
Springer ISBN 978-3-540-43181-7
Format (B x L): 15,5 x 23,5 cm
Gewicht: 1760 g
In englischer Sprache
Das Werk ist Teil der Reihe:
This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.



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Comprehensive book covering the technology of CMP for all semiconductor related materials, as well as the science and modelling of the various mechanisms
Herausgegeben von: link iconM.R. Oliver