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Liu / Salmela / Sarkka

Reliability of Microtechnology

Interconnects, Devices and Systems
2011. Buch. xiii, 204 S.: 50 s/w-Tabelle, Bibliographien. Hardcover
Springer ISBN 978-1-4419-5759-7
Format (B x L): 15,5 x 23,5 cm
Gewicht: 1080 g
In englischer Sprache
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.The book also includes exercises and detailed solutions at the end of each chapter.
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Webcode: beck-shop.de/vigu
Discusses the general failure mechanisms of microsystems on a component level Comprehensive coverage of solder joint reliability at the microsystems level Includes accelerated testing of solder joints at the microsystems level Discusses quality issues and manufacturing at the microsystems level