Erschienen: 08.05.2007 Abbildung von Lee / Kim / Park / Yang | Embedded Software and Systems | 2007 | Third International Conference... | 4523

Lee / Kim / Park / Yang

Embedded Software and Systems

Third International Conference, ICESS 2007, Daegu, Korea, May 14-16, 2007, Proceedings

lieferbar ca. 10 Tage als Sonderdruck ohne Rückgaberecht

139,09 €

inkl. Mwst.

auch verfügbar als eBook (PDF) für 128.39 €

2007. Buch. xix, 829 S. Bibliographien. Softcover

Springer. ISBN 978-3-540-72684-5

Format (B x L): 15,5 x 23,5 cm

Gewicht: 1288 g

In englischer Sprache

Produktbeschreibung

Embeddedsystems,i.e.,computersinsideproducts,havebeenadoptedwidely in manydomains,includingtraditionalcontrolsystems,medicalinstruments,wired and wireless communication devices, aerospace equipment, human-computer - terfaces, and sensor networks. Two signi?cant trends have recently been - serveddue to the increasing computation power and communicationbandwidth. The ?rst is that embedded systems are getting connected and are cooperating as distributed systems. The other is the extensive software in middleware and embedded applications. These trends are apparent in academic and industrial research and in the papers submitted to the International Conference on - bedded Software and Systems. The3rdInternationalConferenceonEmbeddedSoftwareandSystems(ICESS 2007), to be held in Daegu, Republic of Korea, on May 14-16, aims to advance embedded software and systems research, development, and design competence, and to enhance international communication and collaboration. It consists of the traditional core area of embedded systems infrastructure in architecture, software, hardware, real-time computing, and testing and veri?cation, as well as additionalareasofspecialemphasis:pervasive/ubiquitouscomputing andsensor networks, HW/SW co-design and SoC, wireless communications, power-aware computing, security and dependability, and multimedia and HCI. In addition, tutorial sessions on the broad ?elds of embedded computing, a panel discussion session and keynote addresses are included in the conference. Based on the 387 submitted manuscripts and the 77 accepted papers, we expect that the forum will be full of high quality presentations and productive discussions.

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