Erschienen: 31.05.2018 Abbildung von Eskin / Mi | Solidification Processing of Metallic Alloys Under External Fields | 1. Auflage | 2018 | 273 |

Eskin / Mi

Solidification Processing of Metallic Alloys Under External Fields

Buch. Hardcover

1st ed. 2018. 2018

viii, 320 S. 84 s/w-Abbildungen, 115 Farbabbildungen, 87 Farbtabellen, Bibliographien

In englischer Sprache

Springer. ISBN 978-3-319-94841-6

Format (B x L): 15,5 x 23,5 cm

Gewicht: 658 g

Das Werk ist Teil der Reihe: Springer Series in Materials Science; 273


This book explores the application of external physical fields to the solidification processing of metallic alloys. Leading academics from around the world present comprehensive and critical reviews on state-of-the-art research and discuss possible future directions. Major physical fields, including electromagnetic, electric, acoustic, and thermal, are considered. In addition, the most advanced synchrotron X-ray based real-time and in-situ studies and numerical modeling methodologies are reviewed and discussed, with a special emphasis on their applications to the solidification processes. Throughout, all chapters are illustrated with both historical and very recent research cases, including typical examples of in-situ studies, modeling, and simulation. This book contains essential knowledge and information suitable for a wide audience, from undergraduate and postgraduate students to academics, practicing researchers, and engineers in materials, metallurgy, and manufacturing. - Presents state-of-the-art research in an important and fast-growing field - Covers fundamental theory, real-time characterization, modeling, and applications - Features a combination of original results and systematic review of published literature by the leading researchers in the world - Represents a comprehensive reference for researchers and engineers working in materials processing

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