Erschienen: 13.06.2013 Abbildung von Deng / Dong | Research Efforts in Material Science and Mechanics Engineering | 1. Auflage | 2013 | Volume 681 |

Deng / Dong

Research Efforts in Material Science and Mechanics Engineering

lieferbar, ca. 10 Tage




360 S

In englischer Sprache

Trans Tech Publications. ISBN 978-3-03795-431-7

Format (B x L): 12,5 x 14,2 cm

Gewicht: 200 g

Das Werk ist Teil der Reihe: Advanced Materials Research; Volume 681


Volume is indexed by Thomson Reuters CPCI-S (WoS).
International Conference on Engineering Materials for Electronics, Communication and Construction 2012 (EMECC 2012) was held on Aug. 25-26, 2012, Hangzhou, China. EMECC was initially created by a network of researchers and engineers both from academia and industry in the areas of material science and mechanics engineering. The goal of EMECC 2012 is to bring together researchers from the academia and practitioners from the industry in order to address fundamentals and applications of material science and mechanics. The conference provides a forum where researchers shall be able to present recent research results and new research problems and directions related to them. The conference seeks contributions presenting novel research in all aspects of new advanced methods for material science and mechanics.

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