Erschienen: 30.04.2007 Abbildung von The Art and Science of Microsystem Packaging | 2007 | 201

The Art and Science of Microsystem Packaging

lieferbar, ca. 4 Wochen

2007. Buch. Hardcover

Springer-Verlag New York. ISBN 978-0-387-48904-9

In englischer Sprache

Das Werk ist Teil der Reihe: Microsystems; 201


The Art and Science of Microsystem Packaging is writtenfor microsystem, MEMS and microfabrication engineers who are designing microsystem packages or systems that use microsystem package technology.

Thisbook is a reference for practicing engineers, both industrial and academic, who are designing either micromachined products or products that contain micromachined devices. Emphasis is placed on materials, technologies and assembly processes and guidelines that are either being used in production today, are production worthy, or have a good chance of being developed to a level needed to package a saleable product. The reader is assumed to have general understanding of micromachined concepts and semiconductor fabrication technology.


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