Detailsuche

Adams / Alford / Mayer

Silver Metallization

Stability and Reliability
Anyone involved in circuit technology will find this an absolute must-read.
2007. Buch. xii, 123 S.: 66 s/w-Abbildungen, 10 s/w-Tabelle, Bibliographien. Hardcover
Springer ISBN 978-1-84800-026-1
Format (B x L): 15,5 x 23,5 cm
Gewicht: 377 g
In englischer Sprache
Das Werk ist Teil der Reihe:
Here is the first book to discuss the current understanding of silver metallization and its potential as a future interconnect material for integrated circuit technology. With the lowest resistivity of all metals, silver is an attractive interconnect material for higher current densities and faster switching speeds in integrated circuits. Over the past ten years, extensive research has been conducted to address the issues that have prevented silver from being used as an interconnect metal. The authors provide details on a wide range of experimental, characterization, and analysis techniques. The book is written for students, scientists, engineers, and technologists in the fields of integrated circuits and microelectronics research and development.
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lieferbar, ca. 4 Wochen
149,79 €
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Webcode: beck-shop.de/bdaun
First book to discuss current knowledge of silver metallization and its potential as a favourable candidate for implementation as a future interconnect material for integrated circuit technology Valuable resource in this emerging field Provides detailed information on a wide range of experimental characterization and analysis techniques